Temperature-Controlled Chuck
BBI-CH-250
Elevate your thermal testing precision with the BBI-CH-250, a high-performance, temperature-controlled chuck engineered for rapid heating and flawless stability. Designed to accelerate your workflow, it powers from ambient to 250°C in under 60 minutes, utilizing an advanced closed-loop PID control system to maintain a razor-sharp ±1°C set-point accuracy. At its core is a robust 15 mm substrate—available in your choice of premium copper or aluminum—shielded by a 20 µm electroless nickel coating to ensure perfectly uniform heat distribution across the entire 200 × 200 mm² working surface. Complete with an embedded 3-wire PT1000 sensor for ultra-reliable temperature tracking and an intuitive touchscreen electronics control box, the BBI-CH-250 seamlessly blends industrial-grade accuracy with effortless user operation.
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Explore the BBI-CH-250
Intuitive Control at Your Fingertips: The integrated touchscreen display offers seamless, real-time monitoring and precise PID temperature adjustments for the BBI-CH-250.
Where can be used
The BBI-CH-250 is essential for semiconductor engineers, materials scientists, and quality assurance technicians who require precise, uniform, and rapid thermal control for testing electronics and advanced substrates.
Why it fits: The high uniform heating (200 x 200 mm) easily accommodates standard wafer sizes, while the tight +/- 1 Deg PID control ensures stable thermal conditions for measuring leakage current, threshold voltages, and electrical performance variations.
The 60-minute ramp time allows labs to rapidly reach the target 250 deg soak temperature. The robust 15 mm copper or aluminum substrate serves as an excellent heat sink/source, ensuring that heavy component loads do not cause localized cooling or hot spots.
The 20um electroless nickel coating provides a highly flat, durable, and chemically resistant surface that protects the chuck from wear and tear during diverse material processing experiments.
The embedded 3-wire PT1000 sensor provides a highly accurate, repeatable temperature reference point, giving engineers a trusted baseline to calibrate and validate their own sensor outputs.
The BBI-CH-250 acts as a catalyst for industrial R&D and high-volume manufacturing by offering a highly reliable, laboratory-grade thermal platform that accelerates product time-to-market. Proudly engineered and manufactured under the "Make in India" initiative, this chuck provides global-spec performance with local agility, drastically reducing lead times and supply chain dependencies for domestic and international tech sectors. A standout feature of the BBI-CH-250 is its capacity for high-level customization; it can be tailored with bespoke vacuum groove patterns, specialized mounting holes, alternative surface coatings, or modified dimensions to seamlessly integrate into existing probe stations, automated test equipment (ATE), and unique experimental setups. By bridging the gap between rigorous academic research and rugged industrial testing, this versatile device empowers engineers to confidently validate next-generation electronics on a platform built to their exact specifications.